Hi Bond

Hi Bond

Film Adhesives carefully tailored for implanting chips into smart cards and offers an exceptional level of safety and accuracy. These adhesives offer a high level of practicality and security, which are then appropriate for PVC, ABS composite and Polycarbonate cards and have been advanced for use with an immense variety of module types. (FR4 and FCOS). The adhesives are well-suited with all key production machines and has been an increasing convenience for smart card industrial manufacturers.

NEWSLETTER SIGNUP


GET IN TOUCH

CARDCore Group is a global leading multi-channel comparison service for Gift, Loyalty, Membership, RFID, SIM and Smart Card products. CARDCore provides businesses with the convenience of online comparison and the benefit of telephone-based advice.

Mail: info@cardcoregroup.com
Phone:

Malaysia +60 133 623 983

United States +1 917 720 3274

South Africa +27 110 835 056

United Kingdom +44 20 7193 3496

Address: Unit 8, Level 15, Menara One Mont Kiara, No. 1
Jalan Kiara, Mont Kiara, Kuala Lumpur, 50480, MALAYSIA